WIRE
1/2010 April

USP-TWIN ultrasonic machine.
Photos: Eder Engineering
Die working equipment line
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Eder Engineering GmbH is a technological leader and global player in the wire drawing die tool and drawing die processing technology sector (hardware & software) and supplies its products (80 % die-tool processing machines – 15% die-tools – 5% software) directly and via its network of international representations to the international wire and cable industry worldwide. Disposing of the presently largest available portfolio of leading high tech die-tool working machines, e.g. the unique USP-TWIN ultrasonic machine, Eder-Austria also have recently developed various die-workshop ancillary deviceswhich will contribute to release the difficult job of reconditioning dies additionally. The following of these ancillary devices will be displayed at the Eder-Stand a side of the main die working equipment line. VDSU –Vacuum Drawing Die Suction Unit: This ancillary die-workshop device has been developed to clean die-bores from severe liquid dirt, such as drawing emulsions and other liquid working materials etc. by means of an integrated powerful suction pump system. DEZ 2/080 – Wire Pulling Device for Drawing of Measuring Wires: Electrically activated wire pulling device for drawing of measuring wires for diameter control of drawing dies with round bores, by means of subsequent wire diameter measurement. This auxiliary die-workshop unit has been designed to easen the pulling/drawing through of measuring wires in wire drawing dies of between about 0.10 up to 4.00mm diameter (larger à˜-ranges possible). ZTE – Wire Pulling and Elongation Measuring Device: Electrically activated wire pulling device for introduction-drawing of wires and measuring of elongations for a relevant controlling of drawing die sets with round bores.
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