At wire Zumbach will present many new developments and products. New laser based diameter gauges for small cables and wires. Besides the complete line of Odac® laser diameter gauges, new models with special laser beam geometry, fault detection function and high scan rate will be exhibited. New measuring gauge for big dimensions with HLF technology. 3-axis laser diameter gauges with incorporated fault detection. New, very compact 3-axis fault detectors. The advanced Odex® concentricity and diameter gauge for wire extrusion. Fully non-contact, based on magnetic and laser technology. Ultrasonic wall thickness scanners with quick and easy adaptation to cable diameters and space-saving integration. New, economic and compact data acquisition, processing and display unit. Full program of Usys processors, ranging from a low-cost basic model up to the high-end multi-sensor processor/controller. All Usys processors are extremely user-friendly, safe, stable and flexible for extension and upgrading. Also new systems for full process monitoring and control will be shown, such as: Rayex® D series: Zumbach’s X-Ray measuring & control system for CV lines, for wall thickness (3 layers), eccentricity and diameter/ovality for CV lines. New: software for easy operation and powerful control functions and data acquisition. New: Cold end system covering Market Trend Needs Wallmaster/Umac® – Diacal Systems Ultrasonic wall thickness and eccentricity systems for cable jackets and Diacal option for fully automatic calibration and control. Cellmaster®, Jacketmaster and Multiline Systems For extrusion and wire drawing, based on the proven Usys line.

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