Innovations in fluoropolymers, to be presented at wire 2008, include new products and technologies for low-loss DuPont Teflon PTFE and FEP wire constructions. A new foam grade, Teflon FEP TE 9810, produces smaller, better dispersed and more homogenous voids compared to previous Teflon foam grades for enhanced electrical properties in wires with melt extruded fluoropolymer insulations. Depending on the construction, this grade, Teflon FEP TE 9810, has the ability to be self skinning, offering production of cost-effective, high-performance foam insulation for data cables. It enables the extrusion of all three sections of a skin-foam-skin construction – an inner-skin to ensure mechanical adhesion of the foam to the copper conductor, the foam itself and an outer, protective skin – in a single shot without the need for a second extruder and without the need for a multi-layer crosshead.
Meanwhile a new, licensable extrusion technology from DuPont incorporates air into the extruded Teflon PTFE insulation for higher performance, low-loss data cables.
DuPont Teflon and DuPont Tefzel fluoropolymers are commonly used for their insulating capabilities under harsh environmental conditions including high temperatures up to 260oC. Whereas Teflon PTFE, PFA and FEP are chosen for their thermal and chemical resistance in combination with electrical and low-friction properties, Tefzel ETFE is chosen for its mechanical toughness, ease of processing and high-energy radiation resistance. Both Tefzel and Teflon have low dielectric constants and high volume resistivity as well as approved thermal class ratings (SAE, ISO) for wire insulation.

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