Herndon/USA (iNEMI) — The International Electronics Manufacturing Initiative (Inemi), an industry-led consortium focused on identifying and closing technology gaps, has outlined a set of recommendations to help the electronics industry manage Pb-free alloy alternatives. Inemi’s recommendations support the guidelines developed by the EMS Forum to address these same issues.
Although SAC 305/405 have been the most commonly used Pb-free alloys to date, they do not meet all of industry’s needs for all applications, and new alloy solutions continue to be introduced. iNemi recommends the following to help manufacturers manage the use of multiple solder alloys:
– Drive convergence of Pb-free alloys
– Develop an industry-standard assessment methodology
– Establish performance guidelines
– Update standards
– Identify and differentiate alloys
Inemi members supporting these recommendations include: Agilent Technologies, Celestica, Cisco, Delphi Electronics & Safety, Flextronics International, Hewlett-Packard, Intel Corporation, Jabil Circuit, Motorola, Plexus Corp., Sanmina-SCI, Sun Microsystems and Texas Instruments.

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