Book provides in-depth information for implementing Pb-free solder in electronic assemblies. The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, today announced publication of Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing. The book, published by Wiley-IEEE Press, is based on the results of iNEMI’s more than six-year study into lead-free electronics, and it provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly.
The movement to lead-free electronic assembly represented one of the greatest challenges ever to the electronics industry. For well over 50 years, eutectic tin-lead (SnPb) solder has been studied, categorized and optimized for electronics manufacturing applications. In a few short years, Pb-free solder assembly had to be put into wide-scale production, disrupting the status quo. Much of the work to rally the electronics industry to prepare for Pb-free assembly is described in this book.
Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing features chapters by some of the industry’s leading experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, tin whisker mitigation strategies and more.
Available internationally from several online booksellers, including Amazon, Barnes & Noble, Blackwell and E-Campus.com and at Wiley-IEEE Press website at http://www.wiley.com/wileycda/wileytitle/productcd...,minisitecd-ieee2.html
472 pages, US$ 99,95
ISBN 978-0-471-44887-7

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